Multilayer PCBs

  • High Multilayer count and high complex boards upto 24 layers.
  • Sequential lamination for blind and buried vias.
  • Hybrid circuits with FR4 material with PTFE material.
  • Multilayers are with various RF materials like FR4, PTFE, Polyimide, Ceramic filled materials, etc.
  • Boards are with BGA via hole filled / via in pads with cap plating.