- High Count Multilayer upto 24 Layers
- Sequential Lamination for Blind & Buried Vias
- BGA with Via-in-Pad Technology with Cap Plating
- Variety of Impedance (Single & Differential) with -/+ 5%
- Finishes include HAL, LF HAL, ENIG, Immersion Tin, Immersion Silver, Soft Gold on Copper, Hard Gold, Electrolytic Tin, Electrolytic Nickel
- Process Board from 0.5 mm to 5.50 mm
