Multilayer Impedance Controlled Blind / Buried Via PCBs


  • High Count Multilayer upto 24 Layers
  • Sequential Lamination for Blind & Buried Vias
  • BGA with Via-in-Pad Technology with Cap Plating
  • Variety of Impedance (Single & Differential) with -/+ 5%
  • Finishes include HAL, LF HAL, ENIG, Immersion Tin, Immersion Silver, Soft Gold on Copper, Hard Gold, Electrolytic Tin, Electrolytic Nickel
  • Process Board from 0.5 mm to 5.50 mm