- Polyamide Materials including Dupont AP Series
- Three Dimensional Inter Connect Capability
- Combining the Advantages of Both PCBs in One Circuit Board Offers Several Benefits such as Reducing Size of the Assemblies and Enabling 3D Installation of PCBs in Assembly
- Offering for Application Reliability in Demanding Applications & Complex Board Designs
- Strong Electrical, Mechanical, Physical & Thermal Properties
- Uniform Thickness & Dimensional Stability
- Higher Heat Dissipation Properties
- Heat Management in Electrical Assemblies
- Military & High Reliable Commercial Applications
- Used in Missile, Space, Automotive, Medical, Computers, etc.