| Thickness (micron) | 4-12 |
| Surface Planarity | – – |
| Shelf Life | + + |
| Thermal Loading | + |
| 70/125/150 oC | |
| Multi Soldering 02 | + + |
| Multi Soldering N2 | + + |
| Bonding (Al/Au) | – – |
| Thermal Stress | – – |
| Soldermask Compatibility | + + |
| Spring / Contact Switching | – – |
| Press Fit Technology | + – |
| Applications | SMT(Double Sided) Computer, Computer Products |
| Thickness (micron) | 1 |
| Surface Planarity | + + |
| Shelf Life | + |
| Thermal Loading | + |
| 70/125/150 oC | |
| Multi Soldering 02 | + + |
| Multi Soldering N2 | + + |
| Bonding (Al/Au) | – – |
| Thermal Stress | + + |
| Soldermask Compatibility | + |
| Spring / Contact Switching | – – |
| Press Fit Technology | + + |
| Applications | SMT(Double Side) Computer, Computer Products, Communication |
| Thickness (micron) | 0.1 – 0.2 |
| Surface Planarity | + + |
| Shelf Life | + + |
| Thermal Loading | + + |
| 70/125/150 oC | |
| Multi Soldering 02 | + + |
| Multi Soldering N2 | + + |
| Bonding (Al/Au) | To Be Qualified |
| Thermal Stress | + + |
| Soldermask Compatibility | + + |
| Spring / Contact Switching | To Be Qualified |
| Press Fit Technology | + – |
| Applications | SMT (Double Side) Computer, Computer Products, Communication |
| Thickness (micron) | 4 – 8 Ni 0.05 – 0.1m Au |
| Surface Planarity | + + |
| Shelf Life | + |
| Thermal Loading | + + |
| 70/125/150 oC | |
| Multi Soldering 02 | + + |
| Multi Soldering N2 | + + |
| Bonding (Al/Au) | + + |
| Thermal Stress | + – |
| Soldermask Compatibility | + + |
| Spring / Contact Switching | + |
| Press Fit Technology | + – |
| Applications | SMT Keypads, COB, Computer, Telecommunication |
| Thickness (micron) | 4 – 8 Ni 0.2 – 0.3 P 0.05 – 0.1m Au |
| Surface Planarity | + + |
| Shelf Life | + |
| Thermal Loading | + + |
| 70/125/150 oC | |
| Multi Soldering 02 | + + |
| Multi Soldering N2 | + + |
| Bonding (Al/Au) | + + |
| Thermal Stress | + + |
| Soldermask Compatibility | + + |
| Spring / Contact Switching | + |
| Press Fit Technology | + – |
| Applications | BGA, MCM High Tech Interconnect, Packaging |
| Thickness (micron) | 4-12 |
| Surface Planarity | – – |
| Shelf Life | + + |
| Thermal Loading | + |
| 70/125/150 oC | |
| Multi Soldering 02 | + + |
| Multi Soldering N2 | + + |
| Bonding (Al/Au) | – – |
| Thermal Stress | – – |
| Soldermask Compatibility | + + |
| Spring / Contact Switching | – – |
| Press Fit Technology | + – |
| Applications | SMT (Double Sided) Computer, Computer Products |
| Thickness (micron) | 2-4 |
| Surface Planarity | + + |
| Shelf Life | + + |
| Thermal Loading | + |
| 70/125/150 oC | |
| Multi Soldering 02 | + + |
| Multi Soldering N2 | + + |
| Bonding (Al/Au) | + + |
| Thermal Stress | + + |
| Soldermask Compatibility | NA |
| Spring / Contact Switching | + + |
| Press Fit Technology | NA |
| Applications | Satellite Communication Systems |
