Finishes

 Thickness (micron) 4-12
 Surface Planarity – –
 Shelf Life + +
 Thermal Loading +
 70/125/150 oC
 Multi Soldering 02 + +
 Multi Soldering N2 + +
 Bonding (Al/Au) – –
 Thermal Stress – –
 Soldermask Compatibility + +
 Spring / Contact Switching – –
 Press Fit Technology + –
 Applications SMT(Double Sided) Computer, Computer Products
 Thickness (micron) 1
 Surface Planarity + +
 Shelf Life +
 Thermal Loading +
 70/125/150 oC
 Multi Soldering 02 + +
 Multi Soldering N2 + +
 Bonding (Al/Au) – –
 Thermal Stress + +
 Soldermask Compatibility +
 Spring / Contact Switching – –
 Press Fit Technology + +
 Applications SMT(Double Side) Computer, Computer Products, Communication
 Thickness (micron) 0.1 – 0.2
 Surface Planarity + +
 Shelf Life + +
 Thermal Loading + +
 70/125/150 oC
 Multi Soldering 02 + +
 Multi Soldering N2 + +
 Bonding (Al/Au) To Be Qualified
 Thermal Stress + +
 Soldermask Compatibility + +
 Spring / Contact Switching To Be Qualified
 Press Fit Technology + –
 Applications SMT (Double Side) Computer, Computer Products, Communication
 Thickness (micron) 4 – 8 Ni
0.05 – 0.1m Au
 Surface Planarity + +
 Shelf Life +
 Thermal Loading + +
 70/125/150 oC
 Multi Soldering 02 + +
 Multi Soldering N2 + +
 Bonding (Al/Au) + +
 Thermal Stress + –
 Soldermask Compatibility + +
 Spring / Contact Switching +
 Press Fit Technology + –
 Applications SMT Keypads, COB, Computer, Telecommunication
 Thickness (micron) 4 – 8 Ni
0.2 – 0.3 P
0.05 – 0.1m Au
 Surface Planarity + +
 Shelf Life +
 Thermal Loading + +
 70/125/150 oC
 Multi Soldering 02 + +
 Multi Soldering N2 + +
 Bonding (Al/Au) + +
 Thermal Stress + +
 Soldermask Compatibility + +
 Spring / Contact Switching +
 Press Fit Technology + –
 Applications BGA, MCM High Tech Interconnect, Packaging
 Thickness (micron) 4-12
 Surface Planarity – –
 Shelf Life + +
 Thermal Loading +
 70/125/150 oC
 Multi Soldering 02 + +
 Multi Soldering N2 + +
 Bonding (Al/Au) – –
 Thermal Stress – –
 Soldermask Compatibility + +
 Spring / Contact Switching – –
 Press Fit Technology + –
 Applications SMT (Double Sided) Computer, Computer Products
 Thickness (micron) 2-4
 Surface Planarity + +
 Shelf Life + +
 Thermal Loading +
 70/125/150 oC
 Multi Soldering 02 + +
 Multi Soldering N2 + +
 Bonding (Al/Au) + +
 Thermal Stress + +
 Soldermask Compatibility NA
 Spring / Contact Switching + +
 Press Fit Technology NA
 Applications Satellite Communication Systems