Thickness (micron) | 4-12 |
Surface Planarity | – – |
Shelf Life | + + |
Thermal Loading | + |
70/125/150 oC | |
Multi Soldering 02 | + + |
Multi Soldering N2 | + + |
Bonding (Al/Au) | – – |
Thermal Stress | – – |
Soldermask Compatibility | + + |
Spring / Contact Switching | – – |
Press Fit Technology | + – |
Applications | SMT(Double Sided) Computer, Computer Products |