Fine-Line Circuits Limited – India's Leading Printed Circuit Boards Manufacturer

Our Aspiration for Fine-Line is to be a Performance Driven, Reliable, Continuously Improving, High Quality, Medium Volume independent manufacturer, exporter” Pleasing customer 100%” in the complex High Count Multilayer PCB.
To achieve true & sustainable MIL Approval & ISO 9001:2000.
To have a manufacturing base in each of the major market served by the company.

To complete in the world markets by continuously improving capability to handle higher PCB complexity (thinner lines & smaller holes) and gear up for smaller lot sizes and shorter lead times and border range of materials & finishes all at a continuously reducing selling price.

Our Vision for Fine-Line is to be a Reliable, Quality, Volume Manufacturer, Exporter, “Pleasing Customers 100%” in the Complex High Count Multilayer Printed Circuit Boards and gear up for smaller lot sizes and shorter lead times with broader range of Materials and Finishes.

Fine-Line Circuits commit itself to manufacture and deliver defect free PCB’s to manufacturing industries by continually upgrading the Services, Process capability, Product range, and with a constant customer focus shall achieve customer satisfaction.

PTFE Material including Rogers TMM, 5000 Series & 6000 Series
With or Without Copper Backup
Superior Mechanical, Electrical & Thermal Properties
Surface Finish including Electrolytic Soft Gold (2-8 micron) Direct on Copper
Excellent Surface Smoothness for Optimal Skin Effect Performance
Burr Free Route Edges
Excellent Dimensional Accuracy
Legacy of Space Applications since 2016 including Satellite Communication Systems, Antenna Systems, Air Borne Radar Systems, etc.
ISRO SAC Certificates

Material with Low Loss DK
Materials includes those of Rogers (3K, 4K, 5K, 6K & TMM), Panasonic (Megtron), Taconic (TLY), Arlon (AD Series), ISOLA (Astra), X77, etc.
Superior Mechanical, Electrical & Thermal Properties
Variety of Hybrid Multilayer Stack-ups
Power Back Panels
Embedded Cu, AL Cores
Surface Finish include 1 to 4 um Gold of Copper, ENIG, Immersion Tin, Immersion Silver, Electro-Deposited Tin
Applications include Aerospace Systems, Naval Systems, Medical Equipments, Explosion Protection, High End Instrumentation, High End Industrial

Polyamide Materials including Dupont AP Series
Three Dimensional Inter Connect Capability
Combining the Advantages of Both PCBs in One Circuit Board Offers Several Benefits such as Reducing Size of the Assemblies and Enabling 3D Installation of PCBs in Assembly
Offering for Application Reliability in Demanding Applications & Complex Board Designs
Strong Electrical, Mechanical, Physical & Thermal Properties
Uniform Thickness & Dimensional Stability
Higher Heat Dissipation Properties
Heat Management in Electrical Assemblies
Military & High Reliable Commercial Applications
Used in Missile, Space, Automotive, Medical, Computers, etc.

High Copper Board

High Count Multilayer upto 24 Layers
Sequential Lamination for Blind & Buried Vias
BGA with Via-in-Pad Technology with Cap Plating
Variety of Impedance (Single & Differential) with -/+ 5%
Finishes include HAL, LF HAL, ENIG, Immersion Tin, Immersion Silver, Soft Gold on Copper, Hard Gold, Electrolytic Tin, Electrolytic Nickel
Process Board from 0.5 mm to 5.50 mm

Single & Double Sided PCBs

High Multilayer count and high complex boards upto 24 layers.
Sequential lamination for blind and buried vias.
Hybrid circuits with FR4 material with PTFE material.
Multilayers are with various RF materials like FR4, PTFE, Polyimide, Ceramic filled materials, etc.
Boards are with BGA via hole filled / via in pads with cap plating.