CAPABILITIES
PRODUCT CAPABILITIES
No. Parameters Standard Complex
1 Base Material FR2,CEM1, CEM3, FR4 of thickness 0.5,0.8 1.0, 1.6, 2.4, 3.2 mm(High Frequency Materials) As standard
2 Minimum Copper Thickness 1/2 oz copper or 18 microns, unbalanced copper
Layers also available on special request.ayers also available on special request.		 As standard
3 Board Thickness 14 Mils to 125 Mils (0.35 to 3.2mm) can be thicknes for special MLB Back Panels As standard
3A Minimum Core thickness for MLBs 6 Mils ( 0.15mm) 4 Mils (0.1mm)
4 OL Track Width/ Space 6/ 6 Mils ( 0.15/ 0.15mm) 5 / 5 Mils (0.127mm) Min. 
5 I/L Track Width/  Space 6/ 6 Mils ( 0.15/ 0.15mm) 5 / 5 Mils (0.127mm) Min. 
6 Minimum Finished Hole size 8 Mils ( 0.2mm) 6 Mils ( 0.15 mm )
7 Minimum SMD Pitch 20 Mils ( 0.5mm) 10 Mils (0.25mm)
8 Minimum  Gap between SMDS 9 Mils (0.225mm) 8 Mils (0.20mm)
9 BGA Pitch 39 Mils  (1mm) 32 Mils (0.81mm)
10 Cu Thick/ Tr. Width/ Space 35 µ with 6 Mils Track/ 6 Mils Spacing 35 µ with 5/5 Mils
70 µ with 12 Mils Track / 12 Mils Spacing 70 µ with 10/10 Mils
105 µ with 14 Mils Track / 14 Mils Spacing 105 µ with 12/12 Mils
11 Isolation of Pads or Traces  or SMTs on ground Planes 10 Mils  Minimum (0.25mm) 8 Mils  Minimum (0.2mm)
12 Inner Layer Isolation 14 Mils ( 0.35mm) 12 Mils ( 0.3 mm)
13 Minimum Annual Ring I/L Via 7 Mils ( 0.175mm) 6 Mils (0.15 mm)
14 Minimum Annual Ring O/L Via 7 Mils ( 0.175mm) 6 Mils (0.15 mm)
15 Minimum Annual Ring Comp 9 Mils (0.225mm) 8 Mils (0.2 mm)
16 Minimum Epoxy space in hatch 10 Mils space (0.25 mm) 8 MILS ( 0.2mm)
17 Aspect Ratio 6 : 1 10:1
18 Buried Via -------- Yes
19 Blind via -------- Yes
20 Maximum PCB or Array Size 2L 15" x 20" . 4 L 15" x 20" As standard
21 Legend Character Width 7 Mils (0.175mm) 6 Mils ( 0.15mm)
22 Carbon (Resistance) > 20 Ohms 10 to 20 Ohms
23 Peelable Mask Thickness 200 microns 250 microns
24 Maximum dia for Peelable Mask 3.2 mm 4.00 mm
25 Non Standard Build-up Refer  Fineline As standard
26 Minimum Scoring Web 12 Mils (0.3mm) 12 Mils (0.3mm)
27 PCB Edge to Clearance 8 Mils (0.2mm)  Minimum 6 Mils ( 0.15mm)
28 Minimum Npth Slot width 1mm 0.8 to 1mm
29 Board Thickness  Tolerance + or -10% + or - 8 to 10%
30 PTH Tolerance + or - 3 Mils + or - 2 Mils
31 NPTH Tolerance + or - 3 Mils + or - 2 Mils
32 Routing Tolerance + or -  8 Mils ( 0.2mm) + or - 6 Mils (0.15mm)
33 Press Fit , Hole Tolerance - 0 + 2 Mils (-0 + 0.05mm) - 0 + 2 Mils
34 Punching  FR4 Board Max Thickness 1.6 mm ( 0.062")  1.6 (0.062")
35 Punching [Single Punch &  Remove]  or   [Punch & Retain] As standard