CAPABILITIES
 
Finishes
 
 
ELECTROLYTIC
GOLD ON COPPER
IMMERSION GOLD
UNIVERSAL
HAL LEAD FREE
TIN FINISH
SILVER FINISH
HASL
Thickness (micron) 2-4 4-8 Ni
0.05-0.1m Au
4-8 Ni
0.2-0.3 P
0.05-0.1m Au
4-12

1

0.1-0.2 4-12
Surface Planarity + + + + + + + + + + + + - -
Shelf Life + + + + + + + + + +
Thermal Loading + + + + + + + + + + +
70/125/150 oC              
Multi Soldering 02 + + + + + + + + + + + + + +
Multi Soldering N2 + + + + + + + + + + + + + +
Bonding (Al/Au) + + + + + + - - - - To Be Qualified - -
Thermal Stress + + + - + + - - + + + + - -
Soldermask Compatibility NA + + + + + + + + + + +
Spring / Contact Switching + + + + - - - - To Be Qualified - -
Press Fit Technology N A + - + - + - + + + - + -
Applications Satellite Communication Systems
SMT Keypads, COB, Computer, Telecommunication BGA, MCM High Tech SMT (Double Sided) Computer Products SMT (Double Sided) Computer Products, Communication SMT (Double Sided) Computer Products SMT (Double Sided) Computer Products