CAPABILITIES
Finishes
 
HASL
TIN FINISH
SILVER FINISH
IMM. GOLD
UNIVERSAL
HAL LEAD FREE
Thickness (micron) 4-12 1 0.1-0.2 4-8 Ni
0.05-0.1m Au

4-8 Ni
0.2-0.3 P
0.05-0.1m Au

 4-12
Surface Planarity - - + + + + + + + + - -
Shelf Life + + + + + + + + +
Thermal Loading + + + + + + + + +
70/125/150 oC            
Multi Soldering 02 + + + + + + + + + + + +
Multi Soldering N2 + + + + + + + + + + + +
Bonding (Al/Au) - - - - To Be Qualified + + + + - -
Thermal Stress - - + + + + + - + + - -
Soldermask Compatibility + + + + + + + + + + +
Spring / Contact Switching - - - - To Be Qualified + + - -
Press Fit Technology + - + + + - + - + - + -
Applications SMT(Double Sided) Computer,
Computer Products
SMT(Double Side) Computer,
Computer Products,
Communication 		SMT(Double Side) Computer,
Computer Products,
Communication 		SMT Keypads,
COB, Computer,
Telecommunication		 BGA, MCM High Tech Interconnect, Packaging SMT(Double Sided) Computer,
Computer Products