CAPABILITIES |
Technology Road Map |
| 04 -05 | 05 - 06 | 06 - 07 | |
| Products | S.S., D.S., MLBs upto 10 layers, | 12 layers +, Impedance controlled, | 16 layer + Blind & Buried |
| High copper thickness (I/L & O/L) | Metalclad, High frequency materials, | Metal clad, Impedance control, | |
| special pcbs | Rigid flex | MLBs. Rigid flex | |
| Line width, spacing | 5 mil / 5 mil | 4 mil / 4 mil | 3 mil / 3 mil |
| BGA | 32 MIL PITCH | 24 MIL PTICH | 20 MIL PITCH |
| Minimum Hole | 10 mil (finished) | 8 mil (finished) | 4 mil (finished) (Laser drilled) |
| Materials | FR4 & High Tg upto 160degree C | Rogers, Taconic materials, High Tg | Rogers, Taconic materials, High Tg |
| Hydrocarbon ceramic - High | 180 degree C & Polymide | 180 degree C & Polymide | |
| frequency & G10 for watch | |||
| Via Hole Tech | PTH, Buried vias | Laser drilled blind and buried vias | |
| Finish | HAL, Immersion gold, Immersion | Lead free solder | Lead free solder |
| Tin, Immersion Silver, Bondable | |||
| gold, Hard Gold, Peelable Mask, | |||
| Carbon | |||
| BBT | Testing up 12 mil ptich SMDs | Testing up 12 mil ptich SMDs | Testing up 12 mil ptich SMDs |
| SMd dam | 5 mil dam in 8 mil gap | 5 mil dam in 8 mil gap | 5 mil dam in 8 mil gap |
| Aspect Ratios | 8:01 | 10:01 | 12:01 |