CAPABILITIES
Technology Road Map
  Current 2011 2012 2013
         
Products



Upto 16 Layer, Impendance Control,
HDI Blind & Buried Vias, High
Copper Thickness (I/L) & (O/L)
Special PCBs, D.S.S.S.
  Rigid Flex  
         
Line Width,
Spacing

100 microns / 100 microns
0.1 mm / 0.1 mm
4 mil / 4 mil
100 microns / 100 microns
0.1 mm / 0.1 mm
4 mil / 4 mil
75 microns / 75 microns
0.08 mm / 0.08 mm
3 mil / 3 mil
75 microns / 75 microns
0.08 mm / 0.08 mm
3 mil / 3 mil
         
BGA


800 microns
0.8 mm
32 mil pitch
600 microns
0.6 mm
24 mil pitch
600 microns
0.6 mm
24 mil pitch
500 microns
0.5 mm
20 mil pitch
         
Minimum Hole


200 microns
0.2 mm
8 mil finish
150 microns
0.15 mm
6 mil finish
150 microns
0.15 mm
6 mil finish
100 microns
0.1 mm
4 mil finish (laser drill)
         
Materials



PET, PEN, Metal Clad, Ceramic,
G10 (for watches), Very High TG
210oC, Rogers, High Frequency,
FR4
Taconic, Stable Core Polyimide  
         
Via Hole Tech Hole filling with Conductive Pattern      
         
Finish



Immersion Gold, Immersion Tin,
Immersion Silver, Bondable Gold,
Hard Gold, Peelable Mask, Carbon,
Lead Free HAL, HAL
     
         
BBT Testing upto 12 mil pitch Testing up 12 mil pitch Testing up 10 mil pitch Testing up 10 mil pitch
         
SMD dam 4 mil dam in 8 mil gap 3 mil dam in 7 mil gap 3 mil dam in 7 mil gap 2 mil dam in 6 mil gap
         
Aspect Ratios 10 : 1 12 : 1 14 : 1 16 : 1
         
Isolation


254 microns
0.254 mm
10 mil
200 microns
0.2 mm
8 mil
150 microns
0.15 mm
6 mil
125 microns
0.127 mm
5 mil
         
Annular Ring


75 microns
0.08 mm
3 mil
50 microns
0.05 mm
2 mil
50 microns
0.05 mm
2 mil
50 microns
0.05 mm
2 mil
         
High Copper

210 microns with imbalance
copper thickness in multilayers
400 microns