CAPABILITIES
Technology Road Map
  04 -05 05 - 06 06 - 07
       
       
Products S.S., D.S., MLBs upto 10 layers, 12 layers +, Impedance controlled, 16 layer + Blind & Buried
  High copper thickness (I/L & O/L)  Metalclad, High frequency materials, Metal clad, Impedance control,
  special pcbs Rigid flex MLBs. Rigid flex
       
       
Line width, spacing 5 mil / 5 mil 4 mil / 4 mil 3 mil / 3 mil
       
BGA 32 MIL PITCH  24 MIL PTICH 20 MIL PITCH
       
Minimum Hole 10 mil (finished) 8 mil (finished) 4 mil (finished) (Laser drilled)
       
Materials FR4 & High Tg upto 160degree C Rogers, Taconic materials, High Tg Rogers, Taconic materials, High Tg
  Hydrocarbon ceramic - High 180 degree C & Polymide  180 degree C & Polymide 
  frequency & G10 for watch    
       
Via Hole Tech PTH, Buried vias   Laser drilled blind and buried vias
       
Finish HAL, Immersion gold, Immersion Lead free solder Lead free solder
  Tin, Immersion Silver, Bondable    
  gold, Hard Gold, Peelable Mask,     
  Carbon    
       
BBT Testing up 12 mil ptich SMDs Testing up 12 mil ptich SMDs Testing up 12 mil ptich SMDs
       
SMd dam 5 mil dam in 8 mil gap 5 mil dam in 8 mil gap 5 mil dam in 8 mil gap
       
Aspect Ratios 8:01 10:01 12:01