CAPABILITIES |
Technology Road Map |
| Current | 2011 | 2012 | 2013 | |
| Products |
Upto 16 Layer, Impendance Control, HDI Blind & Buried Vias, High Copper Thickness (I/L) & (O/L) Special PCBs, D.S.S.S. |
Rigid Flex | ||
| Line Width, Spacing |
100 microns / 100 microns 0.1 mm / 0.1 mm 4 mil / 4 mil |
100 microns / 100 microns 0.1 mm / 0.1 mm 4 mil / 4 mil |
75 microns / 75 microns 0.08 mm / 0.08 mm 3 mil / 3 mil |
75 microns / 75 microns 0.08 mm / 0.08 mm 3 mil / 3 mil |
| BGA |
800 microns 0.8 mm 32 mil pitch |
600 microns 0.6 mm 24 mil pitch |
600 microns 0.6 mm 24 mil pitch |
500 microns 0.5 mm 20 mil pitch |
| Minimum Hole |
200 microns 0.2 mm 8 mil finish |
150 microns 0.15 mm 6 mil finish |
150 microns 0.15 mm 6 mil finish |
100 microns 0.1 mm 4 mil finish (laser drill) |
| Materials |
PET, PEN, Metal Clad, Ceramic, G10 (for watches), Very High TG 210oC, Rogers, High Frequency, FR4 |
Taconic, Stable Core | Polyimide | |
| Via Hole Tech | Hole filling with Conductive Pattern | |||
| Finish |
Immersion Gold, Immersion Tin, Immersion Silver, Bondable Gold, Hard Gold, Peelable Mask, Carbon, Lead Free HAL, HAL |
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| BBT | Testing upto 12 mil pitch | Testing up 12 mil pitch | Testing up 10 mil pitch | Testing up 10 mil pitch |
| SMD dam | 4 mil dam in 8 mil gap | 3 mil dam in 7 mil gap | 3 mil dam in 7 mil gap | 2 mil dam in 6 mil gap |
| Aspect Ratios | 10 : 1 | 12 : 1 | 14 : 1 | 16 : 1 |
| Isolation |
254 microns 0.254 mm 10 mil |
200 microns 0.2 mm 8 mil |
150 microns 0.15 mm 6 mil |
125 microns 0.127 mm 5 mil |
| Annular Ring |
75 microns 0.08 mm 3 mil |
50 microns 0.05 mm 2 mil |
50 microns 0.05 mm 2 mil |
50 microns 0.05 mm 2 mil |
| High Copper |
210 microns with imbalance copper thickness in multilayers |
400 microns | ||